روغن لحیم گانایسی مدل flux1 وزن 50 گرم

It can be used for rework, sphere or pin attachment to BGA, PGA, and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reball. Excellent capacity of solder-stickiness Excellent Anti-wet Capacity Widely used on BGA, PGA, CSP packages, and flip chip operation Suitable for multiple PCB reflow No-clean and Lead-free for environmental protection

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